Dynamicsinpartialtransientliquidphasebonding(PTLPbonding)ofSi3N4ceramicwithTi/Cu/Timulti-interlayerwassystematicallystudiedthroughmicro-analysisofjointinterfaces.Theresultsshowthatgrowthofreactionlayerandisothermalsolidificationprocessiondoatthesametime.GrowthofreactionlayerandmovingofisothermalsolidificationinterfaceobeytheparaboliclawgovernedbythediffusionofparticipatingelementsduringthePTLPbonding.Coordinationoftheabovetwodynamicsprocessisdonethroughtimeandtemperature.Whenreactionlayerthicknessissuitableandisothermalsolidificationprocessisfinished,thehighbondingstrengthatroomtemperatureandhightemperatureareobtained.
