简介:ProblemsaboutsurfacemountingprocessforfinepitchdevicesandreasonsonsolderbridgingofLtypeleaddevicesweldedaredepicted.Bridgingmechanismandinfluencefactorsareanalyzedwithtwo-dimensionalgeometricmodel.Basedonthis,high-densitysurfacemounttechnology(SMT)forfinepitchLtypeleaddevicesheatedbyscan-ninglaserisraised.SurfacemountprocessforQFP208onprintedcircuitboard(PCB)isstudied.Theresultsoftestsarethatitisquitepossibletosolvethesolderbridgingofsurfacemountingforpitchdeviceswithscanninglaser-heat-ingmethod.
简介:TiO2nanoparticleswithdifferentphasesarepreparedbyhydrolysisoftitaniumtetrabutoxideinthepresenceofHCl.ThecompositionandmicrostructureoftheresultingsamplesarestudiedbyXRDandTEM.TheseresultsshowthattherangeofparticlesizeofTiO2isfrom20to30nm.ThemechanismofTiO2photocatalysisreactionhasbeendiscussedextensively.PhotocatalyticactivitiesofnanometerTiO2arealsoevaluatedbydegradationofthecrystalvioletsolution.ExperimentalresultsindicatethatthesynergisticactionofH2O2andultrasonicwavegreatlyenhancesphoto-catalyticreactionofTiO2.
简介:Iron(Ⅲ)-dopednanostructureTiO2-coatedSiO2(TiO2/SiO2)particleswerepreparedusingthelayer-by-layeras-semblytechniqueandtheirphotocatalyticpropertywasstudied.TiO2colloidsweresynthesizedemployingthesol-gelmethodwithTiCl4asaprecursor.ThesampleswerecharacterizedbyFouriertransforminfraredspectroscopy(FTIR),SEM,EDS,XPS,andXRD.TheexperimentalresultsshowthatTiO2nanopowdersonthesurfaceofSiO2particlesarewelldistributed,theamountofTiO2isincreasedwiththeaddingofcoatinglayers,thepureanatase-TiO2coatinglayersaresynthesizedat500°C,andthephotocatalyticactivityofFe3+-dopedTiO2/SiO2ishigherthanthatofundopedTiO2/SiO2.
简介:Nb-24Ti-18Si-2Al-2Hf-4CrandNb-24Ti-18Si-2Al-2Hf-8Cralloyswerepreparedbyarcmeltinginawater-cooledcrucibleunderargonatmosphere.Microstructuralcharacteristicsandoxidationresistanceofthealloysat1250℃wereinvestigated.Theresultsshowthat,whentheCrcontentis4at%,themicrostructuresconsistof(Nb,Ti)_(ss)andNb_5Si_3;asCrcontentincreasesto8at%,C14LavesphaseCr_2Nbisformed.Theisothermaloxidationtestsshowthattheoxidationkineticsofthetwoalloysfollowsimilarfeatures.Theweightgainsofthetwoalloysafteroxidationat1250℃for100hare235.61and198.50mg·cm~(-2),respectively.Duringoxidation,SiO_2,TiO_2,Nb_2O_5andCrNbO_4areformedatfirst.Then,Ti_2Nb_(10)O_(29)isformedafteroxidationfor20minandbeginstochangeintoTiNb_2O_7astheoxidationproceeds.SiO_2isformedassolidstateatfirstbutlaterevolvesintoglassystatetoimprovethecohesionofthescale.Afteroxidationfor100h,oxidationproductsconsistofSiO_2,TiNb_2O_7,Nb_2O_5andCrNbO_4.
简介:建立一种有效修正相场模型来模拟小平面枝晶生长形貌。通过该模型分别研究网格大小、各向异性值、过饱和度及不同重对称性对小平面枝晶生长形貌的影响。结果表明,随着时间的推移,晶核生长为六重对称性的小平面形貌。当网格尺寸大于640×640时,小平面形貌不受模拟网格大小的影响。随着各向异性值的增加,小平面枝晶的尖端速度增大到一个饱和值后再逐渐降小。随着过饱和度的增加,晶核从一个圆形演化为发达的小平面枝晶形貌。根据Wulff理论和对应的小平面对称性模拟形貌图,证明所提出的模型是有效的,并能够拓展到任意重对称性的晶核生长的模拟。
简介:ElectrocrystallizationMechanismofTungsteninMoltenKF-B_2O_3-K_2WO_4WenZhenhuanandLiGuoxun文振环,李国勋(GeneralResearchInstiiuteforNo...
简介:Intheacceleratordrivensub-criticalsystem(ADS)cooledbyliquidPbBialloy,theausteniticstainlesssteel316Lisoneofthecandidatesofstructuralmaterials.However,thecorrosionandwearbehaviorof316Lsteelinthehigh-velocitystreamofliquidPbBiisthemostessentialissue,whichisurgenttobepaidcloseattention.Inordertoacquirethemorphologyandmechanicalpropertiesof316Lsteelintheconditionsofdifferentrelativeflowingvelocity(RFV),respectively2.62m/s,3.69m/s,4.77m/s,theexperimentwascarriedoutindynamicliquidPbBiat550℃,uptoabout1500h.Accordingtotheresults,thesurfaceof316LhasbeencorrodedbadlyandtheelementsofNi,Cr,etc.werefoundtodissolvealot.WiththeincreaseoftheRFV,thefeatureof316Lsurfacechangedfromthesurfacewithmuchdeeperpitsandlooserstructurestotherelativeplanarone,andthethicknessoftheouteroxidelayerdecreasedgraduallywhilethatoftheinneroxidelayerdiminishedalittle,andthemicrohardnessoftheoutermostsubstratealsodeclinedincreasingly,inaddition,thedomainofthepartialsubstratewithitsmicrohardnessbeingaltereddeepenedfurther.Theseexperimentaldatawouldoffertheoreticalbasisandpracticalvaluestostudycorrosionconditionof316LsteelinliquidPbBiwithhigh-velocity.
简介:介绍一种金属/合金的生产方法,用于恒电流和恒电位条件下由混合硫化物(Cu2S,NiS)生产Cu-Ni合金,称为直接电化学还原(DER)。研究槽电压和槽电流等工艺参数对还原得到的化合物组成的影响,以生产工业所需的CuNi10,CuNi20和CuNi30等合金。在1200°C下采用循环伏安法(CV)考察Cu2S和NiS在CaCl2熔体中的电化学行为。根据CV研究结果,Cu2S的阴极还原是一步完成的,即Cu2S?Cu;NiS的阴极还原则分两步进行,即NiS?Ni3S2?Ni。恒电流研究表明,在10A电流下电解15min,可制备出最高硫含量为320×10-6的高纯CuNi10合金。扫描电子显微镜以及能量色散X射线能谱和光学发射光谱(OES)测试结果表明,在2.5V电压下直接电化学还原15min,可制备出杂质含量低(即硫含量小于60×10-6)的所选成分的Cu-Ni合金。
简介:本文采用磁粉、X射线、CT和超声等无损检测和金相分析等方法对40CrNi2Si2,MoVA钢制零件的磁痕显示进行了系统分析。研究认为,40CrNi2Si2MoVA钢制零件的磁痕显示为显微成分沿变形方向偏析导致的马氏体转变点Ms差异所致。显微成分偏析是钢锭结晶过程中不可避免的,但可通过优化熔炼工艺参数降低显微偏析的程度。本文还分析了四种磁痕显示的类型及其判别方法。
简介:Themetal-organicchemicalvapordeposition(MOCVD)techniqueisapromisingprocessforhigh-temperaturesuperconductorYBa2Cu3O7-δ(YBCO)preparation.Inthistechnique,itisachallengetoobtainbariumprecursorswithhighvolatility.Inaddition,thepurity,evaporationcharacteristics,andthermostabilityofadoptedprecursorsinwholeprocesswilldecidethequalityandreproducibleresultsofYBCOfilm.Inthepresentreport,bis(2,2,6,6-tetramethyl-3,5-heptanedionato)barium(Ⅱ)(Ba(TMHD)2)wassynthesized,anditsstructurewasidentifiedbyFTIR,1HNMR,13CNMR,andESI-MSspectroscopy.Subsequently,thethermalpropertiesandthekineticsofdecompositionweresystematicallyinvestigatedbynonisothermalthermogravimetricanalysismethods.BasedontheaverageapparentactivationenergyevaluatedbytheOzawa,Kissinger,andFriedmanmethods,thevolatilizationprocesswasdiscussed,andallresultsshowthatBa(TMHD)2isunstableandhighlysensitivetothechangeoftemperatureduringthewholeevaporationprocess.Therefore,itisveryimportanttochoosesuitablevolatilizationtechnologyandconditionsforavoidingBa(TMHD)2break-down(orthermalaging)duringMOCVDprocess.Subsequently,thepossibleconversionfunctionisestimatedthroughtheCoats-Redfernmethodtocharacterizetheevaporationpatternsandfollowsaphaseboundaryreactionmechanismbythecontractingsurfaceequationwithaverageactivationenergyof118.7kJ.mol-1.
简介:起落架40CrNi2Si2MoVA钢螺桩在安装一段时间后发生了断裂。为确定螺桩断裂的原因,对断裂螺桩断口宏微观形貌、断裂螺桩及对比件的氢含量、材料的性能以及表面损伤等因素进行了检查,并对电镀工艺进行了评定。结果表明,裂纹主要起源于第一螺纹根部的机械损伤部位,源区以沿晶断裂特征为主,断裂件含氢量较高。综合分析认为。螺桩断裂性质为氢致延迟断裂,表面机械损伤对氢吸收和扩散的促进作用和40CrNi2Si2MoVA钢材料高强度所致的高氢脆敏感性是导致断裂的主要原因。