简介：Dynamicsinpartialtransientliquidphasebonding(PTLPbonding)ofSi3N4ceramicwithTi/Cu/Timulti-interlayerwassystematicallystudiedthroughmicro-analysisofjointinterfaces.Theresultsshowthatgrowthofreactionlayerandisothermalsolidificationprocessiondoatthesametime.GrowthofreactionlayerandmovingofisothermalsolidificationinterfaceobeytheparaboliclawgovernedbythediffusionofparticipatingelementsduringthePTLPbonding.Coordinationoftheabovetwodynamicsprocessisdonethroughtimeandtemperature.Whenreactionlayerthicknessissuitableandisothermalsolidificationprocessisfinished,thehighbondingstrengthatroomtemperatureandhightemperatureareobtained.
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